Preparation of sub-floor

Substrate shall be furnished clean, dry, smooth, leveled to a tolerance of no less than 1/8" in 10'0" (3 mm in 3 m). Curing compounds, sealers and all existing mastics must be removed. Substrate should comply with appropriate standards. Use membrane system or equivalent moisture control where necessary. Joints, construction seams, or other irregularities should be filled with quality patching materials meeting industry standards. All contaminants such as grease, wax, oil, sealers, curing materials and old adhesives must be completely removed.

Expansion joints must be provided as per specifications and materials detailed by appropriate Standards. All concrete substrates must be scoured or shot-blasted prior to installation (patching or leveling materials included) to loosen dirt and remove weak surface layer and to reveal any cracking that may exist in the sub-floor.

All dust must be removed by sweeping and/or vacuum as required. Absorbent surfaces shall be primed prior to commencement of tiling. Important Notes: An uneven sub-floor may result in lipping of tiles; a poorly prepared subfloor may result in de-laminating and "druminess".

All sub-floors and pavements may move and provision must be made at the time of installation to allow for this movement, otherwise the floor tiles and/or the joints will crack and grouting become loose. We suggest specifiers include our appropriate cleaning and maintenance routine for all types of situations from food areas to low traffic residential.